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64 Core Processor, That’s it. We require more and We have available more too to grab. -Upto 1000 Core Processors are available as on date. Its not amazing. It’s the current. June 21, 2012


Do you really think, you require 1000 core processor for computing at desktop, mobile devices, tablets level?Year of 2012 has been named for chip, processor and its architecture which enabled multicore processor to be available to enduser for use in embeded devices, mobile devices, tablets, smart phones and still vendor have another six months to go to reach the masses and bring down the cost of these processors.

1. Way back in October of 2009, Tilera Corp announced that it had managed to squeeze 100 cores onto a single chip. The announcement focused on a new line of multi-core processors called the TILE-Gx series. Tilera said it planned to release 16, 36, 64, and 100 core models with the goal of simplifying system architecture. So far, the company has launched the 16, 36, and 64, 100 core core models.

The same chip architecture can take the chip upto 1000-Core Processor.

2. On the other side, Adapteva Aims 64-core Chip at Tablets, Smartphones since these are demanding more computing power, and chip company Adapteva hopes to bring server-type performance to the devices with a chip.

3. MIT’s 100-core CPU will be ready by this year as announced in January 2012.

4. Toshiba Develops 64-Core System-on-Chip for Embedded Apps to be used in digital consumer products, mobiles, tablets, automotive products.

Toshiba Corp. had developed a low-power, many-core System-on-a-Chip (SoC) for embedded applications in such areas as automotive products and digital consumer products. The prototype SoC integrates 64 cores, eight times more than its multi-core predecessor unveiled in 2008 and operates 14 times faster.

Recent advances in multimedia processing, including video encoding and decoding and image recognition, have relied on multi-core processors that combine high performance with low power consumption. Many-core processors go a step further; by increasing the number of cores they boost SoC performance to much higher levels. However, the power consumption and size of many-core SoC have been problems for their use in embedded applications. Toshiba’s many-core SoC secures significant advances in performance while maintaining low power consumption suitable for embedded applications.

Within a 209.3mm2 die, two 32-core clusters are integrated with dynamically reconfigurable processors, hardware accelerators, dual-channel DDR3 memory controller and other peripherals. Processor cores in one cluster share a 2MB level-two cache connected through a tree-based network-on-chip (NoC). The high scalability and low power consumption is accomplished by the parallelized firmware for multimedia applications. For example, MPEG4-AVC/H.264 1080p 30fps decoding requires under 500mW of power, whereas super resolution 4K2K 15fps image processing demands under 800mW. The SoC integrates image recognition hardware accelerators. The new many-core SoC secures 1.5 trillion operations per second at 333MHz, a processing rate 14 times faster than that of its eight-processor multi-core predecessor.

The new SoC applies low power technologies throughout its structure, including multi-level power gating, clock gating and Toshiba’s proprietary low power data-mapping flip-flop circuit. Advancing the fabrication process to 40nm secures a 40% to 50% boost in power efficiency over the company’s previous multi-core chip, manufactured with 65nm process.

Toshiba plans to apply the many-core SoC and its related technologies to high performance over-HD (high definition) resolution image processing and recognition.

So what these processors could effect apart from digital consumer devices such as tablet, android enabled devices including tv.
These processors will be very helpful in below mention high demanding area.

Multimedia Applications:
Video Transcoding/Transrating
Videoconferencing MCU and Endpoints
Streaming IPTV and Video-on-Demand
Video Post-Production Processing

Cloud Computing Applications
Web Applications (LAMP)
Data Caching (memcached)
Database Applications
Storage

Firewall & VPN
Intrusion Detection and Prevention (IDS/IPS)
Application Delivery Controllers (ADC)
L4-7 Deep Packet Inspection
Network Monitoring and Forensics

 

Information Session for Institute’s Post Graduate Diploma in Product Leadership and Launching Exec Post Graduate Diploma in Product Leadership (EPGDPL) by Institute of Product Leadership, Bangalore, India June 20, 2012


Event Title: Information Session for Institute’s Post Graduate Diploma in Product Leadership
Event Date: June 23, 2012
Event Time: 10 AM to 12.30 PM
Event Location: The Paul, Inner Ring Road, Bengaluru, Karnataka, 560071, India

Special:
Launching Exec Post Graduate Diploma in Product Leadership (EPGDPL) – 6 themes, 45 courses, 5 quarters (15 mons)
Delivered by world class faculty from Stanford, MIT, Washington and real product practitioners in face to face experiential learning environment.

Event Description and More Details:
Keeping Mgmt Education Relevant: Adeptive marketing believe that business education needs to become more relevant & actionable for technology professionals working in “IP” based product and services companies.

A special invite just for you to come join the discussion with several R&D Executives in India.

Keynote speakers
P. Gopalakrishnan, Vice President, India Software Labs, IBM
Ganesh K, Head of Engineering, Linkedin, India
Sanjeev Kumar, MD/Head, Informatica of India
Dr. K. Subramaniam, Md Symbol Technologies India (Motorola)
Anand Prahlad, VP Engineering, McAfee India
Srinivasan S, Head of Engineering, Alacatel-Lucent, India
Venkatraman V, Director Engineering, Ericsson India
Sharad Sharma, Exec Council, NASSCOM
Ramkumar Narayanan, VP of Product Management, Yahoo, India

Registration URL:
http://institute-infosession-blr-es2.eventbrite.com/?srnk=1

Contact Person:
Alok at alok@productleadership.in

Mobile: +91-9886301161